SNN65-HXP Datasheet, PDF (1/1 Pages) Laird Tech Smart Technology – Form-In-Place

Innovative Technology
for a Connected World
SNN65-HXP
Form-In-Place
SNN65-HXP Form-In-Place
A rapid-cure, Ag-coated Nickel-filled silicone elastomer Form-in-Place gasket
material.
Laird Technologies introduces its newest line of FIP products—E­­ MI Sentry. These Form-In-Place pastes are
extremely fast curing with reliable shielding effectiveness and strength
Laird Technologies’ Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding
and grounding gaskets onto metal or plastic substrates. This product is particularly ideal for basestations,
PDAs, PC cards, radios, mobile phones, as well as many other cast enclosures and packaged electronic
assemblies.
* does not represent TYPICAL VALUES
actual color
Elastomer
Filler
ELECTRICAL PROPERTIES
Volume Resistivity
Shielding Effectiveness
200 MHz to 10 GHz
PHYSICAL PROPERTIES
Hardness
Density (cured)
Density (uncured)
Compression Set
Adhesion Strength (Al)
Compression-Deflection (a)
at 20% compression
at 40% compression
Temperature Range
UL rating
CURING REQUIREMENTS
Cure Conditions
Cure Time at 125°C (b)
TEST METHOD
MIL-DTL-83528C
Para. 4.5.12
ASTM D2240
ASTM D792
LT-FIP-CLE-09
ASTM D575
LT-FIP-CLE-03
LT-FIP-CLE-07
UL-94
LT-FIP-CLE-14
UNITS
ohm-cm
dB
Shore A
g/cm³
g/cm³
%
N/cm²
lb/in
lb/in
°C
120°C minimum
SNN65-HXP
Silicone
Ag/Ni
0.005
>100
65
3.84
3.78
10*
200
-50°C to 125°C
V0
1.5 hours
global solutions: local support TM
USA: +1 866 928.8181
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
(a) Compression-deflection bead size 0.60 mm (H) x 0.70 mm (W)
(b) Time to effectively cure a bead will necessarily depend on individual conditions,
including bead size, shield size and weight, oven capacity, and oven ramp-rates.
rev. 05/27/10
EMI-DS-FIP-SNN65-HXP 0510
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to
the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential
damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon
request. © Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird
Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third
party intellectual property rights.