SNN60-RXP Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – SNN60-RXP Form-In-Place

Innovative Technology
for a Connected World
SNN60-RXP
Form-In-Place
SNN60-RXP Form-In-Place
A rapid cure, silver/nickel-filled silicone elastomer Form-In-Place gasket material.
Laird Technologies introduces another product in the EMI Sentry family. These Form-In-Place pastes are
extremely fast curing with reliable shielding effectiveness and strength.
Laird Technologies’ Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding
and grounding gaskets onto metal or plastic substrates. This product is particularly ideal for base stations,
PDAs, PC cards, radios, mobile phones, as well as many other cast or plastic enclosures and packaged
electronic assemblies.
* does not represent TYPICAL VALUES
actual color
Elastomer
Filler
Color
ELECTRICAL PROPERTIES
Volume Resistivity
Shielding Effectiveness
200 MHz to 10 GHz
PHYSICAL PROPERTIES
Hardness
Tensile Strength
Tensile Elongation
Density (cured)
Density (uncured)
Compression Set
Adhesion Strength (Al)
Compression-Deflection (a)
at 20% compression
at 40% compression
Temperature Range
UL rating
CURING REQUIREMENTS
Cure Conditions
At 22°C and 50% RH
TEST METHOD
UNITS
SNN60-RXP
Silicone
Silver/Nickel
Tan
MIL-DTL-83528C
Para. 4.5.12
ohm-cm
dB
0.005
>100
ASTM D2240
ASTM D412
ASTM D412
ASTM D792
LT-FIP-CLE-09
ASTM D395
LT-FIP-CLE-03
LT-FIP-CLE-07
UL-94
Shore A
psi
%
g/cm³
g/cm³
%
N/cm²
lb/in
lb/in
°C
60
192
110
3.9
3.1
15
180
1.7
6.4
-50°C to 125°C
V0
15°C to 40°C, 50% relative humidity
LT-FIP-CLE-14
Time before handling
1 hour
Full Cure
24 hours
(a) Compression-deflection bead size 0.62 mm (H) x 0.70 mm (W)
rev. 03/17/10
global solutions: local support TM
Americas: +1 866.928.8181
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com