SNL70-HXP Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – Form-In-Place

Innovative Technology
for a Connected World
SNL70-HXP
Form-In-Place
SNL70-HXP Form-In-Place
A heat-cure, silver/aluminum-filled silicone elastomer Form-In-Place
gasket material.
Laird Technologies introduces its newest line of FIP products—E­­ MI Sentry. These Form-In-Place pastes are
extremely fast curing with reliable shielding effectiveness and strength
Laird Technologies’ Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding
and grounding gaskets onto metal or plastic substrates. This product is particularly ideal for basestations,
PDAs, PC cards, radios, mobile phones, as well as many other cast or plastic enclosures and packaged
electronic assemblies.
* does not represent TYPICAL VALUES
actual color
Elastomer
Filler
ELECTRICAL PROPERTIES
Volume Resistivity
Shielding Effectiveness
200 MHz to 10 GHz
PHYSICAL PROPERTIES
Hardness
Tensile Strength
Tensile Elongation
Density (cured)
Density (uncured)
Compression Set
Adhesion Strength (Al)
Compression-Deflection (a)
at 20% compression
at 40% compression
Temperature Range
UL rating
CURING REQUIREMENTS
Cure Conditions
Cure Time at 125°C (b)
TEST METHOD
MIL-DTL-83528C
Para. 4.5.12
ASTM D2240
ASTM D412
ASTM D412
ASTM D792
LT-FIP-CLE-09
ASTM D395
LT-FIP-CLE-03
LT-FIP-CLE-07
UL-94
LT-FIP-CLE-14
UNITS
ohm-cm
dB
Shore A
kPa
%
g/cm³
g/cm³
%
N/cm²
lb/in
lb/in
°C
120°C minimum
(a) Compression-deflection bead size 0.60 mm (H) x 0.70 mm (W)
(b) Time to effectively cure a bead will necessarily depend on individual conditions,
including bead size, shield size and weight, oven capacity, and oven ramp-rates.
SNL70-HXP
Silicone
Silver/Aluminum
0.005
>90
70
1600
100
2.0
2.0
10
200
2.3
10.5
-50°C to 125°C
V0
1 hour
rev. 07/02/09
global solutions: local support TM
USA: +1 866 928.8181
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com