SNC70-HXP Datasheet, PDF (1/1 Pages) Laird Tech Smart Technology – Form-In-Place

SNC70-HXP
Form-In-Place
SNC70-HXP Form-In-Place
A rapid cure, nickel-coated graphite-filled silicone elastomer Form-In-Place
gasket material.
Laird Technologies introduces another product in the EMI Sentry family. These Form-In-Place pastes are
extremely fast curing with reliable shielding effectiveness and strength
Laird Technologies’ Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding
and grounding gaskets onto metal or plastic substrates. This product is particularly ideal for base stations,
PDAs, PC cards, radios, mobile phones, as well as many other cast enclosures and packaged electronic
assemblies.
* ^{does not represent}
actual color
TYPICAL VALUES
Elastomer
Filler
ELECTRICAL PROPERTIES
Volume Resistivity
Shielding Effectiveness
200 MHz to 10 GHz
PHYSICAL PROPERTIES
Hardness
Density (cured)
Density (uncured)
Compression Set
Adhesion Strength (Al)
Compression-Deflection (a)
at 20% compression
at 40% compression
Temperature Range
UL rating
CURING REQUIREMENTS
Cure conditions
Cure Time at 125°C (b)
TEST METHOD
MIL-DTL-83528C
Para. 4.5.12
ASTM D2240
ASTM D792
LT-FIP-CLE-09
ASTM D395
LT-FIP-CLE-03
LT-FIP-CLE-07
UL-94
LT-FIP-CLE-14
UNITS
ohm-cm
dB
Shore A
g/cm³
g/cm³
%
N/cm²
lb/in
lb/in
°C
120°C minimum
SNC70-HXP
Silicone
Nickel/Graphite
0.030
>90
70
2.5
2.3
15
>180
3.2
11.5
-50°C to 150°C
V0
1 hour
(a) Compression-deflection bead size 0.60 mm (H) x 0.70 mm (W)
rev. 07/02/09
(b) Time to effectively cure a bead will necessarily depend on individual conditions, including but not
limited to bead size, shield size and weight, oven capacity, and oven ramp-rates.
Americas: +1 866.928.8181
Europe: +49 8031.2460.0
Asia: +86 755.2714.1166
www.lairdtech.com
EMI-DS-FIP-SNC70-HXP 0113
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