SNC70-HXP-AD Datasheet, PDF (1/1 Pages) Laird Tech Smart Technology – SNC70-HXP-AD FORM-IN-PLACE DESCRIPTION

SNC70-HXP-AD (Preliminary)
Form-In-Place
*does not represent actual color
SNC70-HXP-AD FORM-IN-PLACE DESCRIPTION
A heat cure, nickel/graphite filled silicone elastomer Form-In-Place gasket material.
Laird introduces another product in the EMI Sentry family. SNC70HXP-AD is a Nickel/
Graphite filled silicone paste with very low density and high flow ability. It also has good
shielding performance with balanced mechanical properties. With its fast curing speed, this
paste provides a very cost effective FIP solution.
Laird’s Form-In-Place is an automated system for dispensing conductive elastomer EMI
shielding and grounding gaskets onto metal or plastic substrates. This product is particularly
ideal for base stations, PDAs, PC cards, radios, mobile phones, as well as many other cast or
plastic enclosures and packaged electronic assemblies.
TYPICAL VALUES
CATEGORIES
Elastomer
Filler type
ELECTRICAL PROPERTIES
Volume Resistivity
Shielding Effectiveness
200 MHz to 10 GHz
PHYSICAL PROPERTIES
Hardness
Density (cured)
Density (uncured)
Compression Set
Adhesion Strength (Al)
Compression-Deflection (a)
at 20% compression
at 40% compression
Temperature Range
UL Flammability Rating
CURING REQUIREMENTS
Cure Conditions
Curing time at 125°C
TEST METHOD
MIL-DTL-83528C
Para. 4.5.12
ASTM D2240
ASTM D792
LT-FIP-CLE-09
ASTM D395
LT-FIP-CLE-03
LT-FIP-CLE-07
UL94(between Al)
LT-FIP-CLE-14
UNITS
SNC70-HXP-AD
Silicone
Nickel / Graphite
ohm-cm
0.030
dB
>90
Shore A
3
g/cm
3
g/cm
%
65
1.9
1.6
15
>180
lb/in
2.8
lb/in
10.2
°C
-50°C to 125°C
V0 (Pending)
120°C minimum
1hour
(a) Compression-deflection bead size 0.62mm (H) × 0.70mm (W)
(b) Time to effectively cure a bead will necessarily depend on individual conditions, including but not limited to bead size, shield size and
weight, oven capacity, and oven ramp-rates.
USA: +1.866.928.8181
Europe: +49.0.8031.2460.0
Asia: +86.755.2714.1166
www.lairdtech.com
EMI-DS-SNC70-HXP-AD 052815
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