SF800 Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – Exceptionally low thermal resistance

Tflex^™ SF800 Series
Thermal Gap Filler
HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE
GAP FILLER AVAILABLE
Tflex™ SF800 is a high-performance, compliant, silicone free thermal interface material.
By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex™
SF800 provides some of the lowest thermal resistance values in the industry. This makes it
well-suited for applications where silicone based pads are traditionally used as well as those
applications which are silicone sensitive.
Tflex™ SF800 is naturally tacky on both sides requiring no additional adhesive coating, which
would inhibit thermal performance. The natural tack allows for the pad to be held in place
during assembly.
FEATURES AND BENEFITS
• Silicone-free gap filler
• Thermal Conductivity of 7.8 W/mK
• Exceptionally low thermal resistance
• Available in thicknesses from 0.020-inch
(0.50mm) through 0.040-inch (1.00mm)
in 0.010-inch increments
• RoHS Compliant
APPLICATIONS
• Silicone-sensitive applications
• Automotive applications
• Optical components
• Flat panel displays
• Hard disk drives
• Medical devices
• Laser equipment
• Aerospace electronics
• Solar energy
Americas: +1.800.843.4556
Europe: +49.8031.24600
Asia: +86.755.2714.116
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