LOK Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – Low dielectric constant

Eccostock®LoK
Low Loss, Low Dielectric Constant Plastic
LOW LOSS LOW-K DIELECTRIC MATERIAL
Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and
microwave insulation. It weighs only about half that of polystyrene and one quarter that of
polytetrafluorethylene.
Eccostock LoK has better dimensional stability than other low loss plastics. It will not cold flow, nor
will it flow when heat is applied. Soldering iron temperatures will not soften Eccostock LoK, only
slightly degrade in the immediate area of contact.
It is completely unicellular and is unaffected by moisture.
FEATURES AND BENEFITS
MARKETS
• Low dielectric constant
• Lightweight
• Good dimensional stability
• Commercial Telecom
• Security and Defense
SPECIFICATIONS
TYPICAL PROPERTIES
Temperature Range °C (°F)
Frequency
Density g/cc
Dielectric Constant
Dielectric Strength, volts/mil (kv/mm)
Dissipation Factor
Volume Resistivity, ohm-cm
Flexural Strength, kg/cm² (psi)
Coefficient of Linear Expansion, per°C (°F)
Thermal Conductivity W/mK
Water absorption (%gain in 24h at 25°C)
ECCOSTOCK LOK
-70 to 150 (-94 to 302)
60 Hz to 10 Ghz
0.54
1.7
300 (11.8)
<0.004
10¹⁴
420 (6,000)
50 x 10^-6 (28 x 10^-6)
0.4
0.1
Data for design engineer guidance only. Observed performance varies in application. Engineers are
reminded to test the material in application.
APPLICATIONS
• Eccostock LoK is specifically designed for use in coaxial, waveguide and antenna support
problems. Due to the low dielectric constant, reflections in transmission lines are minimized.
• RF coils wound on Eccostock LoK exhibit higher Q than when wound on polystyrene or other
plastic stock.
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