IMPCB-LLD Datasheet, PDF (1/1 Pages) Laird Tech Smart Technology – Lead-free solder compatible

Innovative Technology
for a Connected World
Tlam^TM IMPCB LLD
Thermally Conductive PCB Substrate
ULTRA-BRIGHT LED INSULATED METAL PRINTED CIRCUIT BOARD MATERIAL
Tlam IMPCB LLD is a copper circuit layer and aluminum or copper base plate bonded together with LLD
dielectric. Tlam IMPCB LLD is processed through standard FR4 print and etch operations.
LLD is designed for bright and ultra-bright LED module applications. LLD products have 6-8 times better
thermal conductivity compared to FR4, key to keeping components cool. LLD boards are
processed through standard pick-and-place SMT and manual wire bond operations.
Standard constructions are made with 1 or 2 ounce copper and 0.040 (1) or 0.062 (1.6) inch (mm)
thick aluminum.
FEATURES AND BENEFITS
• RoHS compliant
• Environmentally green
• Lead-free solder compatible
• Uses standard FR4 print and etch processing
APPLICATIONS
• Highway and street lights using LEDs
• Railroad crossing signal lights using LEDs
• BLU for large format LCD TVs
• General lighting
THERMAL PROPERTIES
Thermal Conductivity
UNITS
watt/mº-K
Tlam IMPCB
LLD04
2.0
Thermal Resistance
C-in²/Watt
(C-cm²/Watt)
0.07
(0.504)
Glass Transition Temperature
°C
165
Operating Temperature, Maximum
°C
150
Heat Capacity
ELECTRICAL PROPERTIES
Dielectric Constant @ 1KHz/1MHz
J/g°C
UNITS
1.12
Tlam IMPCB
LLD04
5.1/4.8
Dissipation Factor @ 1KHz
0.007
Capacitance @ 1 KHz
pF/in² (pF/cm²) 287 (44.5)
Volume Resistivity @25°C
ohm-cm
1.0E+15
Volume Resistivity @150°C
ohm-cm
2.0E+12
Surface Resistivity
ohm
1.5E+12
Dielectric Withstand (VDC)
VDC
1800
Dielectric Breakdown (VAC)
VAC
2500
Data for design engineer guidance only.
Typical values, observed performance varies in application.
Engineers are reminded to test the material in application.
Peel strength is measured with 1oz Cu.
MECHANICAL PROPERTIES
Dielectric Thickness
UNITS
inch (mm)
Tlam IMPCB
LLD04
0.004 (0.102)
Peel Strength
pli (kgf/cm) 6.0 (1.1)
CTE < Tg XY/Z axis
ppm/°C
16/36
CTE > Tg XY/Z axis
ppm/°C
18/155
Tensile Strength @ 25/150 °C MD/TD MPa
88/57
Elongation 25/150 °C
%
0.8/1.0
Young's Modulus @ 25/150 °C
MPa
13180/6810
Poisson's Ratio 25/150 °C
0.277/0.263
Flexural Strength 25 °C
AGENCY RATINGS & DURABILITY
UL Flammability
MPa
UNITS
E165095
142
Tlam IMPCB
LLD04
94V0
Solder Float (4 min. @ 288 °C)
Pass
Comparative Tracking Index
600
global solutions: local support TM
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com/thermal
THR-DS-Tlam-IMPCB-LLD 0412
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intellectual property rights. A16230-00 REV C, 04/18/12.