CP2-127-06 Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – Reliable solid state operation

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Ceramic Plate Series CP2-127-06
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is
considered ‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable
TEMs is available in numerous heat pumping capacities, geometric
shapes, and input power ranges. Assembled with Bismuth
Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the CP Series is designed for higher
current and large heat-pumping applications.
FEATURES
• Precise temperature control
• Compact geometric sizes
• Reliable solid state operation
• No sound or vibration
• Environmentally friendly
• DC operation
• RoHS compliant
APPLICATIONS
• Medical lasers
• Lab science instrumentation
• Clinical diagnostics systems
• Photonics laser systems
• Electronic enclosure cooling
• Food & beverage cooling
• Chillers (liquid cooling)
SPECIFICATIONS
TECHNICAL
Hot Side Temperature (°C)
Qmax (Watts)
Delta Tmax (°C)
Imax (Amps)
Vmax (Volts)
Module Resistance (Ohms)
25°C
122.3
67
14.3
14.5
0.94
50°C
134.4
75
14.3
16.4
1.06
SUFFIX
L
L1
L2
ML
LM
MM
THICKNESS
(PRIOR TO
TINNING)
0.180”±0.010”
0.180”±0.010”
0.180”±0.0005”
0.184”±0.010”
0.184”±0.010”
0.188”±0.010”
FLATNESS & HOT FACE
PARALLELISM
0.0025”/0.0025”
0.001”/0.001”
N/A
0.002”/0.002”
0.002”/0.002”
0.002”/0.002”
Lapped
Lapped
Lapped
Metallized
Lapped
Metallized
COLD FACE
LEAD LENGTH
Lapped
4.5”
Lapped
4.5”
Lapped
4.5”
Lapped
4.5”
Metallized
4.5”
Metallized
4.5”
SEALING OPTIONS
SUFFIX SEALANT COLOR
RT
RTV
White
EP
Epoxy
Black
TEMP RANGE
-60 to 204 °C
-55 to 150 °C
DESCRIPTION
Non-corrosive, silicone adhesive
Low density syntactic foam epoxy encapsulant
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