CP085 Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – Compact Geometric Sizes

Innovative Technology
for a Connected World
Ceramic Plate Series CP085,127,06
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered
‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable TEMs is available
in numerous heat pumping capacities, geometric shapes, and input power ranges.
Assembled with Bismuth Telluride semiconductor material and thermally conductive
Aluminum Oxide ceramics, the CP Series is designed for higher current and large
heat-pumping applications.
Features
• Precise Temperature Control
• Compact Geometric Sizes
• Reliable Solid State Operation
• No Sound or Vibration
• Environmentally Friendly
• DC Operation
• RoHS Compliant
Applications
• Medical Lasers
• Lab Science Instrumentation
• Clinical Diagnostic Systems
• Photonics Laser Systems
• Electronic Enclosure Cooling
• Food & Beverage Cooling
• Chillers (Liquid Cooling)
Performance Specifications
Hot Side Temperature (°C)
25°C
50°C
Qmax (Watts)
20.0
21.9
Delta Tmax (°C)
68
75
Imax (Amps)
2.3
2.3
Vmax (Volts)
14.5
16.4
Module Resistance (Ohms)
5.76
6.50
Suffix Thickness
Flatness &
(prior to Tinning) Parallelism
Hot
Face
Cold
Face
Lead
Length
L
0.141”± 0.010”
0.0015” / 0.0015” Lapped Lapped
4.5”
L1
0.141”± 0.001”
0.001” / 0.001” Lapped Lapped
4.5”
L2
0.141”± 0.0005”
0.0005” / 0.0005” Lapped Lapped
4.5”
ML 0.145”± 0.010”
0.002” / 0.002” Metallized Lapped
4.5”
LM 0.145”± 0.010”
MM 0.149”± 0.010”
0.002” / 0.002” Lapped Metallized 4.5”
0.002” / 0.002” Metallized Metallized 4.5”
Sealing Option
Suffix Sealant Color Temp Range Description
RT
RTV
White -60 to 204 °C Non-corrosive, silicone adhesive sealant
EP
Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant
global solutions: local support TM
Americas: +1 888.246.9050
Europe: +46.31.420530
Asia: +86.755.2714.1166
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www.lairdtech.com