CP08-127-05 Datasheet, PDF (1/2 Pages) Laird Tech Smart Technology – Reliable solid state operation

Ceramic Plate Series CP08-127-05
Thermoelectric Modules
The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is
considered ‘the standard’ in the thermoelectric industry.
This broad product line of high-performance and highly reliable TEMs
is available in numerous heat pumping capacities, geometric shapes,
and input power ranges. Assembled with Bismuth Telluride
semiconductor material and thermally conductive Aluminum Oxide
ceramics, the CP Series is designed for higher current and large heat-
pumping applications.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com
FEATURES
• Precise temperature control
• Compact geometric sizes
• Reliable solid state operation
• No sound or vibration
• Environmentally friendly
• DC operation
• RoHS compliant
APPLICATIONS
• Medical lasers
• Lab science instrumentation
• Clinical diagnostic systems
• Photonics laser systems
• Electronic enclosure cooling
• Food & beverage cooling
• Chillers (liquid cooling)
PERFORMANCE SPECIFICATIONS
Hot Side Temperature (°C)
25°C
50°C
Qmax (Watts)
22.6
24.8
Delta Tmax (°C)
67
75
Imax (Amps)
2.6
2.6
Vmax (Volts)
14.4
16.4
Module Resistance (ohms)
5.10
5.75
SUFFIX
L1
L2
ML
LM
MM
THICKNESS
(PRIOR TO TINNING)
0.122”± 0.001”
0.122”± 0.0005”
0.127”± 0.010”
0.127”± 0.010”
0.132”± 0.010”
FLATNESS &
PARALLELISM
0.001” / 0.001”
0.0005” / 0.0005”
0.002” / 0.002”
0.002” / 0.002”
0.002” / 0.002”
HOT
FACE
Lapped
Lapped
Metallized
Lapped
Metallized
COLD
FACE
Lapped
Lapped
Lapped
Metallized
Metallized
LEAD
LENGTH
4.5”
4.5”
4.5”
4.5”
4.5”
SEALING OPTION
SUFFIX SEALANT
RT
RTV
EP
Epoxy
COLOR
White
Black
TEMP RANGE
-60 to 204°C
-55 to 150°C
DESCRIPTION
Non-corrosive, silicone adhesive sealant
Low density syntactic foam epoxy encapsulant
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