900 Datasheet, PDF (1/1 Pages) E-SWITCH – SUB-MINIATURE SMT PUSHBUTTON SWITCHES

Innovative Technology
for a Connected World
Tpcm^™ 900 Series
global solutions: local support TM
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
[e-mail]
www.lairdtech.com/thermal
Tpcm™ 900 is a high performance, non-electrically conductive phasechange material.
At 50°C, Tpcm™ 900 begins to soften and flow,filling the microscopic irregularities
of both the thermal solution andthe component’s surfaces, thereby reducing thermal
resistance.It is a flexible solid at room temperature and freestandingwithout reinforcing
components that reduce thermal performance.
Tpcm 900 shows no performance degradation after 1,000hours @130°C, or after 500
cycles, from -25°C to 125°C. The material softens and does not fully change state, result-
ing in minimal migration(pump out) at operating temperatures (see viscosity curve).
Supplied in rolls with top tabbed liners for easy manual orlarge volume automatic
application. Individually die cut parts can alsobe supplied.
FEATURES AND BENEFITS
• 0.03ºC-in2/watt thermal resistance
• Naturally tacky at room temperature,
no adhesive required
• No heatsink preheating required
• Available in 3 thicknesses, 0.005”, 0.010”and
0.020” (0.125 mm, 0.25 mm and 0.50 mm)
APPLICATIONS
• High frequency
microprocessors
• Notebook and
desktop PCs
• Computer servers
• DC/DC converts
• Memory modules
• Cache chips
• IGBTs
PROPERTIES
Construction &
Composition
Color
Thickness
Thickness Tolerance
Density
Temperature Range
Phase Change
Softening Temperature
“Burn In“ Temperature
Thermal Conductivity
Tpcm™ 905C
Non-reinforced
boron nitride filled film
Yellow
0.005” (0.13 mm)
± 0.001” (± 0.025 mm)
1.31 g/cc
-25 to 125°C
50°C to 70°C
70°C for 5 minutes
0.7 W/mK
Tpcm™ 910
Non-reinforced
boron nitride filled film
Yellow
0.010” (0.25 mm)
± 0.001” (± 0.025 mm)
1.39 g/cc
-25 to 125°C
50°C to 70°C
70°C for 5 minutes
2.23 W/mK
Tpcm™ 920
Non-reinforced
boron nitride filled film
Yellow
0.020” (0.51 mm)
± 0.002” (± 0.05 mm)
1.39 g/cc
-25 to 125°C
50°C to 70°C
70°C for 5 minutes
2.23 W/mK
Thermal Impedance
@ 10 psi (69 KPa)
@ 50 psi (345 KPa))
Volume Resistivity
Dielectric Constant
@1 MHz
0.048 °C-in²/W
(0.31 °C-cm²/W)
0.029 °C-in²/W
(0.19 °C-cm²/W)
2 x 10¹³ ohm-cm
3.1
0.14 °C-in²/W
(0.90 °C-cm²/W)
0.083 °C-in²/W
(0.53 °C-cm²/W)
2 x 10¹³ ohm-cm
3.1
0.18 °C-in²/W
(1.14 °C-cm²/W)
0.095 °C-in²/W
(0.61 °C-cm²/W)
2 x 10¹³ ohm-cm
3.1
Test Method
Visual
Helium Pycnometer
ASTM D5470
(modified)
ASTM D5470
(modified
ASTM D257
ASTM D150
Standard Thicknesses: 0.005” (0.13 mm) 0.010” (0.25 mm) 0.020” (0.51 mm)
Consult the factory for alternate thicknesses
Standard Sheet Sizes: 9” x 9” (229 mm x 229 mm)
Tpcm™ 900 sheets are supplied with a white release paper and a bottom liner.
Tpcm™ 900 is available in rolls with an extended tab liner or individual die cut shapes.
Pressure Sensitive Adhesive: Pressure sensitive adhesive is not applicable for Tpcm™ products.
Reinforcement: No reinforcement is necessary.
THR-DS-Tpcm-900 0910
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application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the
fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages
of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request.
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