L9D340G64BG2 Datasheet, PDF (1/155 Pages) LOGIC Devices Incorporated – 4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD)

PRELIMINARY INFORMATION L9D340G64BG2
4.0 Gb, DDR3, 64 M x 64 Integrated Module (IMOD)
FEATURES
DDR3 Integrated Module [iMOD]:
• Vcc=VccQ=1.5V ± 0.075V
• 1.5V center-terminated, push/pull
I/O
• Package: 16mm x 22mm, 13 x 21
matrix w/ 271balls
• Matrix ball pitch: 1.00mm
Space saving footprint
Thermally enhanced, Impedance
matched, integrated packaging
Differential, bidirectional data strobe
8n-bit prefetch architecture
8 internal banks (per word, 4 words
integrated in package)
Nominal and dynamic on-die termina-
tion (ODT) for data, strobe, and mask
signals.
CAS (READ) latency (CL): 6, 8, and
10
CAS (WRITE) latency (CWL): 6, 7
and 8
Fixed burst length (BL) of 8 and burst
chop (BC) of 4
Selectable BC4 or BL8 on-the-fly
(OTF)
Self/Auto Refresh modes
Operating Temperature Range (Case
Temp=Tc)
• Industrial: -40˚C to 85˚C supporting
SELF & AUTO REFRESH
• Extended: -40˚C to 105˚C; manual
REFRESH only
• Mil-Temp: -55˚C to 125˚C; manual
REFRESH only
CORE clocking frequencies:
• Industrial: 667MHz, 533MHz and
400MHz
• Extended: 533MHz and 400MHz
• Mil-Temp: 400MHz
Data Transfer Rates:
• Industrial: 1333, 1066 and 800
Mbps
• Extended: 1066 and 800 Mbps
• Mil-Temp: 800 Mbps
Write leveling
Multipurpose register
Output Driver Calibration
Benefits
40% space savings while provid-
ing a surface mount friendly pitch
(1.00mm)
Reduced I/O routing (34%)
30% improvement in routings for your
memory array
Reduced trace lengths due to
the highly integrated, impedance
matched packaging
Thermally enhanced packaging
technology allow silicon integration
without performance degradation due
to power dissipation (heat)
High TCE organic laminate inter-
poser for improved glass stability
over a wide operating temperature
Suitability of use in High Reliability
applications requiring Mil-temp, non-
hermetic device operation
*Note: This integrated product and/or its specifications
are subject to change without notice. Latest document
should be retrieved from LDI prior to your design
consideration.
iMOD Part Information
ORDER NUMBER SPEED GRADE DEVICE GRADE PKG FOOTPRINT I/O
L9D340G64BG2I15
L9D340G64BG2E19
L9D340G64BG2M25
DDR3-1333
DDR3-1066
DDR3-800
Industrial
Extended
Mil-Temp
16mm x 22mm
271
PITCH PKG NO.
1.00mm
BG2
LOGIC Devices Incorporated
www.logicdevices.com
integrated module products
1
High Performance, Integrated Memory Module Product
May 19, 2009 LDS-L9D340G6BG2-A