SP3003 Datasheet, PDF (6/8 Pages) Littelfuse – Low Capacitance ESD Protection Array

Silicon Protection Arrays^TM
Low Capacitance ESD Protection Array
Package Dimensions — SOT563
A
D
L
65 4
E
23
HE ^{Solder Pad Layout}
e
c
B
Package Dimensions — MSOP10
Solder Pad Layout
Package
Pins
A
B
c
D
E
e
L
HE
SOT 563
6
Millimeters
Inches
Min
Max
Min
Max
0.50
0.60
0.020
0.024
0.17
0.27
0.007
0.011
0.08
0.18
0.003
0.007
1.50
1.70
0.059
0.067
1.10
1.30
0.50 BSC
0.10
0.30
1.50
1.70
0.043
0.051
0.020 BSC
0.004
0.012
0.059
0.067
Package
Pins
A
A1
B
c
D
E
E1
e
HE
MSOP10
10
Millimeters
Inches
Min
Max
Min
Max
-
1.10
-
0.043
0.00
0.15
0.000
0.006
0.17
0.27
0.007
0.011
0.08
0.23
0.003
0.009
2.90
3.10
0.114
0.122
4.67
5.10
2.90
3.10
0.50 BSC
0.40
0.80
0.184
0.200
0.114
0.122
0.020 BSC
0.016
0.032
Part Numbering System
SP3003-04 X TG
Silicon
Protection
Array
G= Green
T= Tape & Reel
Series
Package
Number of Channels
-02 = 2 channel
(SC70-5, SOT553 packages)
A = MSOP-10, 3000 quantity
J = SC70-5 or SC70-6, 3000 quantity
X = SOT553 or SOT563, 5000 quantity
-04 = 4 channel
(SC70-6, SOT563, MSOP-10 packages)
Part Marking System
XXX
XXX
Product Series
Number of Channels
(varies) F, H or P =
(varies) 2 or 4
SP3003 series _{Assembly Site}
(varies)
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
/PUFT


1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
SP3003 Lead-Free/Green Series
40
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.