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Q6025K6TP Datasheet, PDF (6/11 Pages) Littelfuse – Teccor brand Thyristors | |||
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Teccor® brand Thyristors
25 Amp Standard & Alternistor (High Commutation) Triacs
Soldering Parameters
Reï¬ow Condition
Pb â Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus Temp)
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reï¬ow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
150°C
200°C
60 â 180 secs
5°C/second max
5°C/second max
217°C
60 â 150 seconds
260+0/-5 °C
20 â 40 seconds
5°C/second max
8 minutes Max.
280°C
TP
TL
TS(max)
TS(min)
Ramp-up
Preheat
tS
25
time to peak temperature
tP
tL
Ramp-down
Time
Physical Speciï¬cations
Terminal Finish
Body Material
Lead Material
100% Matte Tin-plated
UL recognized epoxy meeting ï¬ammability
classiï¬cation 94V-0
Copper Alloy
Design Considerations
Careful selection of the correct device for the applicationâs
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Environmental Speciï¬cations
Test
High Temperature
Voltage Blocking
Temperature Cycling
Biased Temp &
Humidity
High Temp. Storage
Speciï¬cations and Conditions
MIL-STD-750: Method 1040, Condition A
Rated VRRM, 125°C, 1008 hours
MIL-STD-750: Method 1051
-40°C to 125°C, 15-minute dwell,
100 cycles
EIA/JEDEC: JESD22-A101
320VDC, 85°C, 85%RH, 1008 hours
MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage -40°C, 1008 hours
Thermal Shock
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
Autoclave
EIA/JEDEC: JESD22-A102
(Pressure Cooker Test) 121°C, 100%RH, 2atm, 168 hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability
ANSI/J-STD-002, Category 3, Test A
Lead Bend
MIL-STD-750: Method 2036, Condition E
Qxx25xx & Qxx25xHx Series
122
Revised: May 10, 2010 09:33 PM
©2010 Littelfuse, Inc
Speciï¬cations are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
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