V18AUMLA1210A Datasheet, PDF (5/7 Pages) Littelfuse – Surface Mount Multilayer Varistors (MLVs) AUML Series

Varistor Products
Surface Mount Multilayer Varistors (MLVs) > AUML Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
DPNQPOFOUT
JO
TVSGBDF
NPVOU
UFDIOPMPHZ
BSF
*3
3FnPX

BOE
8BWF
TPMEFSJOH
5ZQJDBM
QSPmMFT
BSF
TIPXO
PO
UIF
SJHIU
The termination option available for each solder technique is:
3FnPX







































8BWF

/JDLFM
#BSSJFS
QSFGFSSFE








/JDLFM
#BSSJFS
QSFGFSSFE

4JMWFS1MBUJOVN
The recommended solder for the AUML suppressor is
B

4O1C"H

4O1C
PS

4O1C 

-JUUFMGVTF
BMTP
SFDPNNFOET
BO
3."
TPMEFS
nVY
8BWF
TPMEFSJOH
JT
UIF
NPTU
TUSFOVPVT
PG
UIF
QSPDFTTFT

To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
8IFO
VTJOH
B
SFnPX
QSPDFTT
DBSF
TIPVME
CF
UBLFO
UP

FOTVSF
UIBU
UIF
"6.-
DIJQ
JT
OPU
TVCKFDUFE
UP
B
UIFSNBM

gradient steeper than 4 degrees per second; the ideal
HSBEJFOU
CFJOH

EFHSFFT
QFS
TFDPOE
%VSJOH
UIF
TPMEFSJOH

QSPDFTT
QSFIFBUJOH
UP
XJUIJO

EFHSFFT
PG
UIF
TPMEFShT

peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it
is still necessary to ensure that any further thermal
shocks are avoided. One possible cause of thermal
shock is hot printed circuit boards being removed from
UIF
TPMEFS
QSPDFTT
BOE
TVCKFDUFE
UP
DMFBOJOH
TPMWFOUT

at room temperature. The boards must be allowed to
DPPM
HSBEVBMMZ
UP
MFTT
UIBO
$
CFGPSF
DMFBOJOH
Reflow Solder Profile
230
Figure 9
Wave Solder Profile
300
MAXIMUM WAVE 260 ^oC
250
200
150
SECOND PREHEAT
100
FIRST PREHEAT
50
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Figure 10
TIME (MINUTES)
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
5IF
QSFGFSSFE
TPMEFS
JT

4O"H$V
XJUI
BO
3."

flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
JO
UIF
-FBEoGSFF
3FnPX
1SPmMF
'PS
-FBEoGSFF
8BWF

TPMEFSJOH
UIF
8BWF
4PMEFS
1SPmMF
TUJMM
BQQMJFT
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Lead–free Re-flow Solder Profile
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
PREHEAT ZONE
Figure 11
5.0
6.0 7.0
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/AUML.html for current information.
Revision: September 14, 2010
AUML Varistor Series