SP3050 Datasheet, PDF (5/7 Pages) Littelfuse – Low Capacitance Diode Array for ESD and Surge Protection

SPA™ Silicon Protection Array Products
Low Capacitance Diode Array for ESD and Surge Protection
Soldering Parameters
Reflow Condition
1C
o
'SFF
BTTFNCMZ
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
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217°C
60 – 150 seconds
250^+0/-5 °C
20 – 40 seconds
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260°C
Package Dimensions - SOT23-6
Recommended Solder Pad Layout
M
P
R
O
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Package
SOT23-6
Pins
6
JEDEC
MO-203 Issue A
Millimeters
Min
Max
Inches
Min
Max
Notes
A
0.900
1.450
0.035
0.057
-
A1
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 ref
-
e1
1.9 Ref
0.0748 Ref
-
L
0.100
0.600
0.004
0.023
 
N
6
6
6
a
0º
10º
0º
10º
-
M
2.590
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
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SP3050 Lead-Free/Green Series