SP3004_10 Datasheet, PDF (5/6 Pages) Littelfuse – SPA™ Silicon Protection Array Products Low Capacitance ESD Protection Array

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions - SOT563
A
D
L
65 4
E
HE
23
e
c
B
Solder Pad Layout
Part Numbering System
SP3004-04X T G
Silicon
Protection
Array
Series
Number of Channels
-04 = 4 channel
G= Green
T= Tape & Reel
Package
X = SOT563, 5000 quantity
Part Marking System
GX4
GX4
Product Series
G = SP3004 series
Number of Channels
Assembly Site
(varies)
Ordering Information
Part Number
SP3004-04XTG
Package
SOT563
Package
Pins
A
B
c
D
E
e
L
HE
SOT 563
6
Millimeters
Inches
Min
Max
Min
Max
0.50
0.60
0.020
0.024
0.17
0.27
0.007
0.011
0.08
0.18
0.003
0.007
1.50
1.70
0.059
0.067
1.10
1.30
0.50 BSC
0.10
0.30
1.50
1.70
0.043
0.051
0.020 BSC
0.004
0.012
0.059
0.067
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Subsitute Material
Body Material
Flammability
Pre-Plated Frame
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL94-V-0
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
Marking
GX4
Min. Order Qty.
5000
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
77
Revised: August 19, 2010
SP3004 Lead-Free/Green Series