SP3003_10 Datasheet, PDF (5/8 Pages) Littelfuse – Low Capacitance ESD Protection Array

SPA™ Silicon Protection Array Products
Low Capacitance ESD Protection Array
Package Dimensions — SC70-5
ee
6
5
not used
4
E HE
1 23
B
D
A2 A
Solder Pad Layout
A1
C
L
Package Dimensions — SC70-6
ee
654
E HE
1 23
B
D
A2 A
Solder Pad Layout
A1
C
L
Package Dimensions — SOT553
A
D
L
65 4
(not used)
E
23
Solder Pad Layout
HE
e
c
B
Package
Pins
JEDEC
A
A1
A2
B
c
D
E
e
HE
L
SC70-5
5
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
Package
Pins
JEDEC
A
A1
A2
B
c
D
E
e
HE
L
SC70-6
6
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
Package
Pins
A
B
c
D
E
e
L
HE
SOT 553
5
Millimeters
Inches
Min
Max
Min
Max
0.50
0.60
0.020
0.024
0.17
0.27
0.007
0.011
0.08
0.18
0.003
0.007
1.50
1.70
0.059
0.067
1.10
1.30
0.50 BSC
0.10
0.30
1.50
1.70
0.043
0.051
0.020 BSC
0.004
0.012
0.059
0.067
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
69
Revised: August 19, 2010
SP3003 Lead-Free/Green Series