SMF8.5A Datasheet, PDF (5/6 Pages) Littelfuse – Transient Voltage Suppression Diodes Surface Mount – 200W > SMF Series

Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Soldering Parameters
Reflow Condition
Lead–free assembly
T_P
- Temperature Min (T_s(min))
150°C
Pre Heat - Temperature Max (T_s(max))
200°C
T_L
- Time (min to max) (t_s)
60 – 180 secs
T_s(max)
Average ramp up rate (Liquidus Temp
(T_L) to peak
3°C/second max
T_s(min)
T_S(max) to T_L - Ramp-up Rate
3°C/second max
Reflow ^{-Temperature (TL) (Liquidus) 217°C}
25˚C
- Time (min to max) (t_s)
60 – 150 seconds
Peak Temperature (T_P)
260^+0/-5 °C
Time within 5°C of actual peak
Temperature (t_p)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (T_P)
Do not exceed
8 minutes Max.
260°C
Ramp-up
t_p
t_L
Critical Zone
T_L to T_P
t_s
Preheat
Ramp-down
t 25˚C to Peak
Time (t)
Physical Specifications
Case
SOD-123 Plastic over glass passivated
junction
Polarity
Color band denotes cathode except bipolar
Terminal
Matte tin-plated leads, solderable per
JESD22-B102D
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
JESD22-A104
JESD22-A102
JESD22-A103
JESD22-A108
JESD22-A106
SMF Series
5
11
Revision: February 29, 2012, 15:16
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.