V22CH8_10 Datasheet, PDF (4/6 Pages) Littelfuse – Surface Mount Varistors

Varistor Products
Surface Mount Varistors > CH Series
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
CH series devices have silver-platinum terminals (Ag/Pt),
and the recommended solder is 62/36/2 (Sn/Pb/Ag), 60/40
(Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an
RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the CH chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Lead–free (Pb-free) Soldering Recommendations
CH series devices have silver-platinum terminals (Ag/Pt),
and the recommended Lead-free solder is 96.5/3.0/0.5
(SnAgCu) with an RMA flux, though there is a wide
selection of pastes and fluxes available that should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free Wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Reflow Solder Profile
250
MAXIMUM TEMPERATURE
230°C
200
40-80
SECONDS
ABOVE 183°C
150
RAMP RATE
<2°C/s
100
PREHEAT DWELL
50
PREHEAT ZONE
0
0
Figure 7
0.5 1.0
1.5 2.0 2.5 3.0 3.5 4.0
TIME (MINUTES)
Wave Solder Profile
300
MAXIMUM WAVE 260°C
250
200
150
SECOND PREHEAT
100
FIRST PREHEAT
50
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
Figure 8
TIME (MINUTES)
Lead–free Re-flow Solder Profile
300
MAXIMUM TEMPERATURE 260˚C,
TIME WITHIN 5˚C OF PEAK
250
20 SECONDS MAXIMUM
RAMP RATE
200
<3˚C/s
60 - 150 SEC
> 217˚C
150
100
PREHEAT ZONE
50
0
0
1.0
2.0 3.0 4.0 5.0 6.0 7.0
Figure 9
TIME (MINUTES)
CH Varistor Series
Revision: August 30, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/CH.html for current information.