V0402MHS03N_10 Datasheet, PDF (4/5 Pages) Littelfuse – Surface Mount Multilayer Varistors (MLVs)

Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Lead–free (Pb-free) Soldering Recommendations
Littelfuse offers the Nickel Barrier Termination finish for the
optimum Lead–free solder performance.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA
flux, but there is a wide selection of pastes and fluxes
available with which the Nickel Barrier parts should be
compatible.
The reflow profile must be constrained by the maximums
in the Lead–free Reflow Profile. For Lead–free wave
soldering, the Wave Solder Profile still applies.
Note: the Lead–free paste, flux and profile were used for
evaluation purposes by Littelfuse, based upon industry
standards and practices. There are multiple choices of all
three available, it is advised that the customer explores the
optimum combination for their process as processes vary
considerably from site to site.
Product Dimensions (mm)
PAD LAYOUT DEMENSIONS
Lead–free Re-flow Profile
MAXIMUM TEMPERATURE 260˚C
20 - 40 SECONDS WITHIN 5˚C
RAMP RATE
<3˚C/s
60 - 150 SEC
> 217˚C
PREHEAT ZONE
Figure 10
5.0
6.0 7.0
CHIP LAYOUT DIMENSIONS
E
Note: Avoid metal runs in this area, parts are
not recommended for use in applications using
Silver (Ag) epoxy paste.
D
L
W
Dimension
A
B
C
D (max.)
E
L
W
0402 Size
IN
MM
0.067
1.700
0.020
0.510
0.024
0.610
0.024
0.600
0.10 +/- 0.006 0.25 +/- 0.15
0.039 +/- 0.004 1.00 +/- 0.10
0.020 +/- 0.004 0.50 +/- 0.10
0603 Size
IN
MM
0.100
2.540
0.030
0.760
0.035
0.890
0.040
1.000
0.015 +/- 0.008 0.4 +/- 0.2
0.063 +/- 0.006 1.6 +/- 0.15
0.032 +/- 0.006 0.8 +/- 0.15
MHS Varistor Series
Revision: June 28, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.