SP3011 Datasheet, PDF (4/6 Pages) Littelfuse – Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection

SPA™ Silicon Protection Array Products
Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection
Application Example
USB Port
V_BUS
Outside
World
SSTX+
SSTX-
SSRX+
SSRX-
GND
D+
D-
USB Controller
IC
SP3011-06UTG
Soldering Parameters
Reflow Condition
1C
o
'SFF
BTTFNCMZ
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
250^+0/-5 °C
20 – 40 seconds
6°C/second max

NJOVUFT
.BY
260°C
Signal GND
SP3011 Lead-Free/Green Series
88
Revised: May 10, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.