SP3002_11 Datasheet, PDF (4/6 Pages) Littelfuse – SP3002 Series 0.85pF Rail Clamp Array

TVS Diode Arrays (SPA^™Family of Products)
Low Capacitance ESD Protection - SP3002 Series
Package Dimensions — SC70-6
ee
654
E HE
1 23
B
D
A2 A
A1
C
Solder Pad Layout
L
Package Dimensions — SOT23-6
Recommended Solder Pad Layout
M
P
R
O
Package
Pins
JEDEC
A
A1
A2
B
c
D
E
e
HE
L
SC70-6
6
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.80
1.10
0.031
0.043
0.00
0.10
0.000
0.004
0.70
1.00
0.028
0.039
0.15
0.30
0.006
0.012
0.08
0.25
0.003
0.010
1.85
2.25
0.073
0.089
1.15
1.35
0.045
0.053
0.65 BSC
0.026 BSC
2.00
2.40
0.079
0.094
0.26
0.46
0.010
0.018
Package
Pins
JEDEC
A
A1
A2
b
C
D
E
E1
e
e1
L
N
a
M
O
P
R
SOT23-6
6
MO-203 Issue A
Millimeters
Inches
Min
Max
Min
Max
0.900
1.450
0.035
0.057
0.000
0.150
0.000
0.006
0.900
1.300
0.035
0.051
0.350
0.500
0.0138
0.0196
0.080
0.220
0.0031
0.009
2.800
3.000
0.11
0.118
2.600
3.000
0.102
0.118
1.500
1.750
0.06
0.069
0.95 Ref
0.0374 Ref
1.9 Ref
0.0748 Ref
0.100
0.600
0.004
0.023
6
6
0º
10º
0º
10º
2.590
0.102
0.690
.027 TYP
0.990
.039 TYP
0.950
0.038
Notes
-
-
-
-
-
3
-
3
-
-
4,5
6
-
-
-
-
-
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily
exact.
SP3002 Series
92
Revision: April 14, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.