SP2502L Datasheet, PDF (4/5 Pages) Littelfuse – The SP2502L provides overvoltage protection for applications such as 10/100/1000 Base-T Ethernet and T3/E3 interfaces.

TVS Diode Arrays (SPA^™Family of Products)
Lightning Surge Protection - SP2502L Series
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Part Marking System
L^{F SP2502}
CYYWW
Marking
Date code
Pin1
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Body Material
Silicon
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Part Numbering System
SP2502L B T G
Silicon
Protection Array
Series
G= Green
T= Tape & Reel
Package
B = SOIC-8
Ordering Information
Part Number
SP2502LBTG
Package
SOIC-8
Marking
SP2502
Min. Order Qty.
2500
SP2502L Series
4
Revision: August 13, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.