SL1011A350A Datasheet, PDF (4/6 Pages) Littelfuse – SL1011A/B and SL1411A Series

Gas Discharge Tube (GDT) Products
SL1011A/B and SL1411A Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
Pb-free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (Min to Max) (t_s)
Average Ramp-up Rate (Liquidus Temp
(T_L) to peak)
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of Actual Peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to Peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 seconds
3°C/second max.
5°C/second max.
217°C
60 – 150 seconds
260^+0/-5 °C
10 – 30 seconds
6°C/second max.
8 minutes max.
260°C
T_P
T_L
T_S(max)
Ramp-up
T_S(min)
Preheat
t_S
25
time to peak temperature
(t 25ºC to peak)
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100° C
150° C
60-180 seconds
Solder Pot Temperature:
280° C Maximum
Solder Dwell Time:
2-5 seconds
Soldering Parameters - Hand Soldering
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
SL1011A/B and SL1411A Series
50
Revised: June 28, 2010
©2010 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
Customer should verify actual device performance in their specific applications.