600R150 Datasheet, PDF (4/5 Pages) Littelfuse – POLYFUSE® Resettable PTCs

POLYFUSE^® Resettable PTCs
Radial Leaded
Soldering Parameters - Solder Reflow
Condition
Peak Temp/ Duration Time
> _220°C
Preheat 160°C~ 190°C
Storage Condition
Reflow
260°C ^> 5 Sec
30 Sec ~ 60 Sec
60 Sec ~ 90 Sec
0°C~35°C, ^< 70%RH
• Recommended reflow methods: IR, vapor phase oven, hot
air oven, N environment for lead-free.
2
• Devices are not designed to be wave soldered to the
bottom side of the board.
• Devices can be cleaned using standard industry methods
and solvents.
Note: If reflow temperatures exceed the recommended
profile, devices may not meet the performance
requirements.
Physical Specifications
Lead Material
Tin-plated copper
Soldering
Characteristics
Solderability per MIL-STD-202,
Method 208E
Insulating Material
Cured, flame retardant epoxy polymer
meets UL94V-0 requirements.
Device Labeling
Marked with LF, voltage, current rating,
and date code.
Soldering
260
220
Preheating
190
160
Cooling
0
60 to 90
30 to 60
120
Time(s)
Environmental Specifications
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging
85°C/85°C, 1000 hours
Humidity Aging
+85°C, 85%R.H. 1000 hours
Thermal Shock
MIL-STD-202F Method 107G
+125°C to -55°C 10 times
Solvent Resistance
MIL-STD-202, Method 215F
600R Series
Specifications are subject to change without notice.

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