V0402MHS03NR Datasheet, PDF (3/5 Pages) Littelfuse – Surface Mount Multilayer Varistors (MLVs)

Varistor Products
Surface Mount Multilayer Varistors (MLVs) > MHS Series
Device Characteristics
"U
MPX
DVSSFOU
MFWFMT
UIF
7*
DVSWF
PG
UIF
NVMUJMBZFS

transient voltage suppressor approaches a linear (ohmic)
relationship and shows a temperature dependent effect.
At or below the maximum working voltage, the suppressor
is in a high resistance model (approaching 10⁶Ω at its
maximum rated working voltage). Leakage currents at
maximum rated voltage are below 100μ"
UZQJDBMMZ
μA;
for 0402 size below 20μ"
UZQJDBMMZ
μA.
Typical Temperature Dependance of the Characteristic
$VSWF
JO
UIF
-FBLBHF
3FHJPO
100%
Speed of Response
The Multilayer Suppressor is a leadless device. Its
response time is not limited by the parasitic lead
inductances found in other surface mount packages.
The response time of the Z_N0
EJFMFDUSJD
NBUFSJBM
JT
MFTT

UIBO
OT
BOE
UIF
.-&
DBO
DMBNQ
WFSZ
GBTU
E7E5
FWFOUT

such as ESD. Additionally, in “real world” applications,
the associated circuit wiring is often the greatest
factor effecting speed of response. Therefore, transient
suppressor placement within a circuit can be considered
important in certain instances.
Multilayer Internal Construction
FIRED CERAMIC
DIELECTRIC
10%
1E^-9
Figure 5
25^o 50^o 75^o 100^o 125^oC
1E^-8
1E^-7
1E^-6
1E^-5
1E^-4
SUPPRESSOR CURRENT (A_DC)
1E^-3
1E^-2
METAL END
TERMINATION
Figure 6
DEPLETION
REGION
DEPLETION
REGION
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
DPNQPOFOUT
JO
TVSGBDF
NPVOU
UFDIOPMPHZ
BSF
*3
3FnPX

and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MHS suppressor is
B

4O1C"H

4O1C
PS

4O1C 

-JUUFMGVTF
BMTP
SFDPNNFOET
BO
3."
TPMEFS
nVY
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MHS chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
0ODF
UIF
TPMEFSJOH
QSPDFTT
IBT
CFFO
DPNQMFUFE
JU
JT

still necessary to ensure that any further thermal shocks
BSF
BWPJEFE
0OF
QPTTJCMF
DBVTF
PG
UIFSNBM
TIPDL
JT
IPU

printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
UP
MFTT
UIBO
$
CFGPSF
DMFBOJOH
Reflow Solder Profile
Figure 7
Wave Solder Profile
METAL
ELECTRODES
GRAINS
230
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/MHS.html for current information.
Figure 8
Revision: November 29, 2011
MHS Varistor Series