SP4061 Datasheet, PDF (3/4 Pages) Littelfuse – SP4061 Series 2.5V 20A Rail Clamp Array

TVS Diode Arrays (SPA^™Family of Products)
Lightning Surge Protection - SP4061 Series
Capacitance vs. Bias
5.0
4.0
Ordering Information
Part Number
SP4061-04UTG
Package
µDFN-10
Marking Min. Order Qty.
TH4
3000
3.0
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
DC Bias (V)
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Product Characteristics
Lead Plating
Pre-Plated Frame
T_P
T_L
T_S(max)
T_S(min)
25
Ramp-up
Preheat
t_S
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Part Numbering System
SP 4061 ^- 04 U T G
Silicon Protection
Array (SPA^TM)
Family of
TVS Diode Arrays
Series
Number of
Channels
G= Green
T= Tape & Reel
Package
U= µDFN-10
Lead Material
Copper Alloy
Lead Coplanarity
Substitute Material
0.0004 inches (0.102mm)
Silicon
Part Marking System
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
TH4
Product Series
Number of
T = SP4061
Channels
Assembly Site
SP4061 Series
182
Revision: September 22, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.