SP4045-04ATG Datasheet, PDF (3/4 Pages) Littelfuse – TVS Diode Arrays Lightning Surge Protection

TVS Diode Arrays (SPA^®®Diodes)
Lightning Surge Protection- SP4045 Series
Clamping Voltage vs. I_PP
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
1.0 4.0 7.0 10.0 13.0 16.0 19.0 22.0 25.0 28.0
Peak Pulse Current-I_PP (A)
Transmission Line Pulsing (TLP) Plot (Pin 1 to Pin2)
40
35
30
25
20
15
10
5
0
0
5
10
15
20
25
TLP Voltage (V)
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp (T_L)
to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T_P
T_L
T_S(max)
T_S(min)
25
Ramp-up
Preheat
t_S
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Product Characteristics
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
©2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 08/03/15