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SP3304N Datasheet, PDF (3/4 Pages) Littelfuse – The SP3304N integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and ESD.
TVS Diode Arrays (SPA™Family of Products)
Lightning Surge Protection - SP3304N Series
Capacitance vs. Bias
5.0
4.0
3.0
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Bias Voltage (V)
Ordering Information
Part Number
SP3304NUTG
Package
µDFN-10
Marking Min. Order Qty.
UH4
3000
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Temperature (tL)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peak Temperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Product Characteristics
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Body Material
Silicon
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
TP
TL
TS(max)
TS(min)
25
Ramp-up
Preheat
tS
time to peak temperature
tP
Critical Zone
TL to TP
tL
Ramp-down
Time
Part Numbering System
SP 3304N U T G
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Series
G= Green
T= Tape & Reel
Package
U= µDFN-10
Part Marking System
U* 4
Product Series
Number of
U = SP3304N
Channels
Assembly Site
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com for current information.
3
Revision: August 14, 2012
SP3304N