SD05 Datasheet, PDF (3/4 Pages) Semtech Corporation – Single Line TVS Diode for ESD Protection in Portable Electronics

TVS Diode Arrays (SPA^® Diodes)
General Purpose ESD Protection - SD05 Series
Power Derating Curve
110
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
Ambient Temperature - TA(^oC)
Soldering Parameters
Reflow Condition
Pb – Free assembly
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Substitute Material
Body Material
Flammability
Matte Tin
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2013 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 04/24/13
Pulse Waveform
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
T_P
T_L
T_S(max)
T_S(min)
25
Ramp-up
Preheat
t_S
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time