AQ1006 Datasheet, PDF (3/4 Pages) Littelfuse – AEC-Q101 qualified

TVS Diode Arrays (SPA^®Diodes)
General Purpose ESD Protection - SAPQ11000066SSeerriieess
Soldering Parameters
Reflow Condition
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (min to max) (t_s)
Average ramp up rate (Liquidus) Temp (T_L)
to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260^+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
Package Dimensions — μDFN-2 (0201)
TOP VIEW
Pin2
Pin1
BOTTOM VIEW
SIDE VIEW
0.32
0.24
0.14
0.24
0.32
SOLDERING PATTERN
T_P
T_L
T_S(max)
T_S(min)
Ramp-up
Preheat
t_S
25
time to peak temperature
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Product Characteristics
Lead Plating
Matte Tin
Lead Material
Lead Coplanarity
Substrate material
Body Material
Flammability
Copper Alloy
0.004 inches(0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Package
JEDEC
Symbol
A
A1
A2
b
D
E
L1
L2
K1
μDFN-2 (0201)
MO-236
Millimeters
Inches
Min
Max
Min
Max
0.23
0.33
0.009
0.013
0.00
0.05
0.000
0.002
0.10 REF
0.004 REF
0.18
0.30
0.007
0.012
0.55
0.65
0.022
0.026
0.25
0.35
0.010
0.014
0.12
0.24
0.005
0.009
0.12
0.23
0.005
0.009
0.165 REF
0.006 REF
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 04/07/16
SP1006 Series