AC120 Datasheet, PDF (3/4 Pages) Littelfuse – AC and CG3 Series Suppressors

Gas Plasma Arrester (GDT) Products
AC and CG3 Series
Soldering Parameters - Reflow Soldering (Surface Mount Devices)
Reflow Condition
1C
o
'SFF
BTTFNCMZ
- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (Min to Max) (t_s)
Average ramp up rate (Liquidus Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C

o

TFDT
3°C/second max
5°C/second max
217°C

o

TFDPOET
260^+0/-5 °C

o

TFDPOET
6°C/second max

NJOVUFT
.BY
260°C
T_P
T_L
T_S(max)
Ramp-up
T_S(min)
Preheat
t_S
25
time to peak temperature
(t 25ºC to peak)
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
Soldering Parameters - Wave Soldering (Thru-Hole Devices)
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Process Parameters:
Wave Parameter
Preheat:
%FQFOET
PO
'MVY
"DUJWBUJPO
5FNQFSBUVSF




5FNQFSBUVSF
.JOJNVN




5FNQFSBUVSF
.BYJNVN




1SFIFBU
5JNF
Lead-Free Recommendation
5ZQJDBM
*OEVTUSZ
3FDPNNFOEBUJPO
100° C
150° C
60-180 seconds
Solder Pot Temperature:
280° $
.BYJNVN
Solder Dwell Time:
2-5 seconds
Soldering Parameters - Hand Soldering
4PMEFS
*SPO
5FNQFSBUVSF

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)FBUJOH
5JNF


TFDPOET
NBY
AC and CG3 Series
Revised: August 11, 2009
©2008 Littelfuse, Inc.
Specifications are subject to change without notice.
Refer to www.littelfuse.com/series/AC.html or /CG3.html for current information.