578244 Datasheet, PDF (3/6 Pages) Littelfuse – 2920L Series

POLYFUSE^® Resettable PTCs
Surface Mount > 2920L Series
Soldering Parameters
Condition
Reflow
Peak Temp/ Duration Time
260°C / 10 Sec
Time above liquids (TAL) 220°C
60 Sec ~ 100 Sec
Preheat 120°C~ 180°C
Storage Condition
50 Sec ~ 150 Sec
0°C~35°C, ^<=70%RH
• Recommended reflow methods: IR, vapor phase oven, hot air
oven, N₂ environment for lead–free
• Recommended maximum paste thickness is 0.25mm (0.010 inch)
• Devices can be cleaned using standard industry methods and
solvents.
Note: If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Soldering
260
220
Preheating
180
120
Cooling
0
50 to 150
60 to 100
120
Time(s)
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
Environmental Specifications
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped
State
Passive Aging
-40°C to +85°C
125°C
+85°C, 1000 hours
-/+5% typical resistance change
Humidity Aging
+85°C, 85%,R.H.,1000 hours
-/+5% typical resistance change
Thermal Shock
MIL-STD-20 2, Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
MIL–STD–202, Method 215
Vibration
MIL–STD–883C, Method 2007.1,
Condition A
Moisture Sensitivity Level Level 1, J–STD–020C
©2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/2920L.html for current information.
53
Revised: December 2, 2009
2920L Series