2016L030 Datasheet, PDF (3/4 Pages) Littelfuse – POLYFUSE® Resettable PTCs

POLYFUSE^® Resettable PTCs
Surface Mount
Soldering Parameters
Condition
Reflow
Peak Temp/ Duration Time
260°C / 10 Sec
Time above liquids (TAL) 220°C
60 Sec ~ 100 Sec
Preheat 120°C~ 180°C
Storage Condition
50 Sec ~ 150 Sec
0°C~35°C, ^<=70%RH
• R ecommended reflow methods: IR, vapor phase oven, hot air
oven, N₂ environment for lead-free
• Devices are not designed to be wave soldered to the bottom side
of the board.
• Recommended maximum paste thickness is 0.25mm (0.010 inch)
• Devices can be cleaned using standard industry methods and
solvents.
Note: If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
Meets EIA Specification RS186-9E, ANSI/
J-STD-002 Category 3.
Soldering
260
220
Preheating
180
120
Cooling
0
50 to 150
60 to 100
120
Time(s)
Environmental Specifications
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
+85°C, 1000 hours
±5% typical resistance change
+85°C, 85%R.H. 1000 hours
±5% typical resistance change
MIL-STD-202 Method 107G
+85°C/-40°C 20 times
-30% typical resistance change
MIL-STD-202, Method 215
No change
MIL-STD-883C, Method 2007.1,
Condition A
No change
2016L Series
Specifications are subject to change without notice.

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