SP6001_11 Datasheet, PDF (2/4 Pages) Littelfuse – Silicon Protection Array (SPA™) Products 12pF EMI Filter Array with ESD Protection

Silicon Protection Array (SPA^™) Products
12pF EMI Filter Array with ESD Protection
Absolute Maximum Ratings
Thermal Information
Symbol
T_OP
T_STOR
Parameter
Operating Temperature
Storage Temperature
Value
-40 to 85
-60 to 150
Units
°C
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Parameter
Storage Temperature Range
Maximum Junction Temperature
Maximum Lead Temperature (Soldering 10s)
Rating
-65 to 150
150
260
Units
°C
°C
°C
Electrical Characteristics (T_OP=25ºC)
Parameter
Symbol
Test Conditions
Min
Typ
Reverse Standoff Voltage
Breakdown Voltage
V_RWM
V_BR
I_R=1mA
7.0
(-10% of Typ)
7.8
Reverse Leakage Current
I
LEAK
Resistance
R
A
V =5V
RWM
I =10mA
R
0.1
85
(-15% of Typ)
100
Diode Capacitance^1,2
C
D
Line Capacitance^1,2
C_L
V =2.5V,f=1MHz
R
V_R=2.5V,f=1MHz
12
19
(-20%of Typ)
24
IEC61000-4-2 (Contact Discharge)
±30
ESD Withstand Voltage¹
V_ESD
IEC61000-4-2 (Air Discharge)
±30
Cutoff Frequency³
F_-3dB
Above this frequency, appreciable
attenutation occurs
115
Notes: ¹ Parameter is guaranteed by design and/or device characterization.
2 Total line capacitance is two times the diode capacitance (C ).
D
3 _{50Ω source and 50Ω load termination}
Max
6.0
8.5
(+10%of Typ)
1.0
115
(+15% of Typ)
29
(+20%of Typ)
Units
V
V
μA
Ω
pF
pF
kV
kV
MHz
Insertion Loss (S21)
Analog Crosstalk (S41)
CH1 S ²¹
log MAG
5 dB/ REF 0 dB
1 _:-5.8807 dB
CH1 S
log MAG
10 dB/
REF 0 dB
Cor
Smo
1
Cor
Del
Smo
1
x2
Start 3.000 000MHz
Stop 6 000.000.000MHz
x2
START 3.000 000 MHz
Stop 6 000.000 000 MHz
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Subsitute Material
Body Material
Flammability
Pre-Plated Frame
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL94-V-0
SP6001 Series
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
142
Revised: January 11, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.