808 Datasheet, PDF (2/4 Pages) Littelfuse – Subminiature Fuses

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Temperature Derating Curve
140
120
100
80
60
40
20
0
-60
25°C
-20
20
60
100
AMBIENT TEMPERATURE ( )
Average Time Current Curves
100
140
10
1
0.1
0.01
Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
0.001
1
10
100
1000
CURRENT IN AMPERES
Recommended Process Parameters:
Wave Parameter
Preheat:
%FQFOET
PO
'MVY
"DUJWBUJPO
5FNQFSBUVSF




5FNQFSBUVSF
.JOJNVN




5FNQFSBUVSF
.BYJNVN




1SFIFBU
5JNF
Lead-free Recommendation
5ZQJDBM
*OEVTUSZ
3FDPNNFOEBUJPO
100¡
$
150¡
$

TFDPOET
Solder Pot Temperature:
Solder Dwell Time:
260¡
$
.BYJNVN

TFDPOET
Recommended Hand-Solder Parameters:
4PMEFS
*SPO
5FNQFSBUVSF

¡
$

¡$
)FBUJOH
5JNF


TFDPOET
NBY
Note: These devices are not recommended for IR or
Convection Reflow process.
808 Series
2
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/808.html for current information.