807XXXX000 Datasheet, PDF (2/3 Pages) Littelfuse – LEAD-FREE AND ROHS COMPLIANT

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Temperature De-rating Curve
140%
120%
100%
80%
60%
40%
20%
0%
-55
-30
807 DE-RATING CURVE
-5
20
45
70
AMBIENT TEMPERATURE (°C)
95
120
Average Time Current Curves
1000.000
100.000
10.000
1.000
0.100
0.010
0.001
0.1
1
10
100
1000
CURRENT [A]
Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Process Parameters:
Wave Parameter
Lead-Free Recommendation
Preheat:
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Temperature Minimum:
100˚C
ÊÊÊÊ/i“«iÀ>ÌÕÀiÊ>݈“Õ“\
150˚C
ÊÊÊÊ*Ài…i>ÌÊ/ˆ“i\
60-180 seconds
Solder Pot Temperature:
260˚ Ê>݈“Õ“
Solder Dwell Time:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350˚C ± 5˚C
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Note: These devices are not recommended for IR or
Convection Reflow Process.
TE-UMF 807 Series
2
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/807.html for current information.