456 Datasheet, PDF (2/4 Pages) Littelfuse – Surface Mount Fuses

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Temperature Rerating Curve
60
40
20
0
0
20
40
60
-60°C -40°C -20°C
-76°F -40°F -4°F
0°C 20°C 40°C 60°C 80°C
32°F 68°F 104°F 140°F 176°F
AMBIENT TEMPERATURE
100°C
212°F
120°C 140°C
248°F 264°F
Average Time Current Curves
100
10
1
0.1
Soldering Parameters – Reflow Soldering
Reflow Condition
1C
o
'SFF
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- Temperature Min (T_s(min))
Pre Heat - Temperature Max (T_s(max))
- Time (Min to Max) (t_s)
Average ramp up rate (Liquidus Temp
(T_L) to peak
T_S(max) to T_L - Ramp-up Rate
Reflow
- Temperature (T_L) (Liquidus)
- Temperature (t_L)
Peak Temperature (T_P)
Time within 5°C of actual peak
Temperature (t_p)
Ramp-down Rate
Time 25°C to peak Temperature (T_P)
Do not exceed
150°C
200°C

o

TFDT
5°C/second max.
5°C/second max.
217°C

o

TFDPOET
250^ °C

o

TFDPOET
5°C/second max.
8 minutes max.
260°C
0.01
1
10
100
1000
CURRENT IN AMPERES
T_P
T_L
T_S(max)
Ramp-up
T_S(min)
Preheat
t_S
25
time to peak temperature
(t 25ºC to peak)
t_P
Critical Zone
TL to TP
t_L
Ramp-down
Time
456 Series
66
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/456.html for current information.