40005000000 Datasheet, PDF (2/4 Pages) Littelfuse – Subminiature Fuses

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Temperature Rerating Curve
140
120
100
80
60
40
23°C
20
0
-40
-20
0
20
40
60
80
AMBIENT TEMPERATURE (°C)
Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Average Time Current Curves
100
10
1
0.1
0.01
0.001
0
1
10
100
CURRENT IN AMPERES
1000
Recommended Process Parameters:
Wave Parameter
Preheat:
%FQFOET
PO
'MVY
"DUJWBUJPO
5FNQFSBUVSF




5FNQFSBUVSF
.JOJNVN




5FNQFSBUVSF
.BYJNVN




1SFIFBU
5JNF
Lead-Free Recommendation
5ZQJDBM
*OEVTUSZ
3FDPNNFOEBUJPO
100° C
150° C

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Solder Pot Temperature:
260° $
.BYJNVN
Solder Dwell Time:

TFDPOET
Recommended Hand-Solder Parameters:
4PMEFS
*SPO
5FNQFSBUVSF

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Note: These devices are not recommended for IR or
Convection Reflow process.
400 Series
2
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/400.html for current information.