209 Datasheet, PDF (2/4 Pages) CTS Corporation – AUTO-DIP® Switch Automatically Insertable, Wave Solderable, Board Washable DIP Switch

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Temperature Rerating Curve
Average Time Current Curves
Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Lead-Free Recommendation
5ZQJDBM
*OEVTUSZ
3FDPNNFOEBUJPO
100° C
150° C
60-180 seconds
Solder Pot Temperature:
260° C Maximum
Solder Dwell Time:
2-5 seconds
Recommended Hand-Solder Parameters:
4PMEFS
*SPO
5FNQFSBUVSF

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Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
209 Series
252
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/209.html for current information.