0262.002V Datasheet, PDF (2/3 Pages) Littelfuse – 262/268/269 Series, MICRO™ Very Fast-Acting Fuse (High-Reliability)

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Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100° C
150° C
60-180 seconds
Solder Pot Temperature:
260° C Maximum
Solder Dwell Time:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
Temperature Rerating Curve
Please contact Littelfuse for average time current curve.
262/268/269 Series
128
Revised: January 7, 2009
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/262.html,
/268.html or /269.html for current information.