ZEN059V130A24LS Datasheet, PDF (1/9 Pages) Littelfuse – Single component placement

PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 1 OF 9
Specification Status: Released
GENERAL DESCRIPTION
Littelfuse PolyZen devices are
polymer-enhanced precision
Zener diode micro-assemblies.
They offer resettable protection
against multi-Watt fault events
and spare the need for large
heavy heat sinks.
A unique feature of the PolyZen
micro-assembly is that the
Zener diode is thermally
coupled to a resistively non-
linear, polymer PTC (Positive Temperature Coefficient) layer.
This PTC layer is fully integrated into the device, and is
electrically in series between VIN and the diode clamped VOUT.
This polymer PTC layer responds to either extended diode
heating or overcurrent events by transitioning from a low to
high resistance state, also known as ”tripping”. A tripped PTC
will limit current and generate voltage drop. It helps to protect
both the Zener diode and the follow-on electronics and
effectively increases the diode’s power handling capability.
The Zener diode used for voltage clamping in a PolyZen
micro-assembly was selected due to its relatively flat voltage
vs current response. This helps improve output voltage
clamping, even when input voltage is high and diode current
is large.
The polymer-enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive
voltage spikes, voltage transients, improper power supplies,
and reverse bias conditions. The PolyZen
ZEN059V130A24LS device is particularly useful for USB
2.0/3.0 powered devices; typically, it draws only 500μA of
operating current in USB Suspend Mode.
BENEFITS
 Stable Zener diode helps shield
downstream electronics from
overvoltage and reverse bias
 PTC trip events help to protect the
Zener diode and extend its power
handling capability
 Analog nature of trip events
minimizes upstream inductive spikes
 Minimal power dissipation
requirements
 Single component placement
FEATURES
 Meets USB Suspend Mode current
requirement - 500μA (typ) @ 5.0V
 Overvoltage transient suppression
 Stable VZ vs fault current
 Time delayed, overvoltage and
reverse bias trip
 Multi-Watt power handling capability
 Integrated device construction
 RoHS Compliant and Halogen Free
TARGET APPLICATIONS
 USB 2.0/3.0 powered consumer
electronics, external hard disk drives
and solid state devices
 DC power port protection in systems
using barrel jacks for power input
 DC power port protection in portable
electronics and navigation devices
 DC output voltage regulation
 USB 3.0 hubs and adapter cards
 Laptops and Desktop PCs
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
littelfuse.com