ZEN056V115A24LS Datasheet, PDF (1/8 Pages) Littelfuse – Single component placement

PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN056V115A24LS
DOCUMENT: SCD27719
REV LETTER: B
REV DATE: JULY 26,2016
PAGE NO.: 1 OF 8
Specification Status: Released
GENERAL DESCRIPTION
Littelfuse PolyZen devices are polymer
enhanced, precision Zener diode micro-
assemblies. They offer resettable
protection against multi-Watt fault events
without the need for multi-Watt heat
sinks.
The Zener diode used for voltage
clamping in a PolyZen micro-assembly
was selected due to its relatively flat voltage vs current
response. This helps improve output voltage clamping, even
when input voltage is high and diode currents are large.
An advanced feature of the PolyZen micro-assembly is that
the Zener diode is thermally coupled to a resistively non-
linear, polymer PTC (positive temperature coefficient) layer.
This PTC layer is fully integrated into the device, and is
electrically in series between VIN and the diode clamped
VOUT.
This advanced PTC layer responds to either extended diode
heating or overcurrent events by transitioning from a low to
high resistance state, also known as ”tripping”. A tripped PTC
will limit current and generate voltage drop. It helps to protect
both the Zener diode and the follow on electronics and
effectively increases the diode’s power handling capability.
The polymer enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive
voltage spikes, voltage transients, incorrect power supplies
and reverse bias. These devices are particularly suitable for
portable electronics and other low-power DC devices.
TYPICAL APPLICATION BLOCK DIAGRAM
Power Supply
(External or Internal)
PolyZen Protected Electronics
BENEFITS
 Stable Zener diode helps shield
downstream electronics from
overvoltage and reverse bias
 Trip events shut out overvoltage
and reverse bias sources
 Analog nature of trip events
minimizes upstream inductive
spikes
 Minimal power dissipation
requirements
 Single component placement
FEATURES
 Overvoltage transient suppression
 Stable VZ vs fault current
 Time delayed, overvoltage trip
 Time delayed, reverse bias trip
 Multi-Watt power handling
capability
 Integrated device construction
 RoHS Compliant
TARGET APPLICATIONS
 DC power port protection in
portable electronics
 DC power port protection for
systems using barrel jacks for
power input
 Internal overvoltage & transient
suppression
 DC output voltage regulation
GND
2
V_{IN 1 PolyZen}
+
Device
V_OUT
3 Regulated
Output
R_Load
Protected downstream
electronics
© 2016 Littelfuse,Inc.
Specifications are subject to change without notice.
Revised July 26,2016
littelfuse.com