PGB1040805MR Datasheet, PDF (1/2 Pages) Littelfuse – PGB1 Series Lead-Free 0805 ESD Suppressor

PulseGuard^® Suppressors
Surface Mount Polymeric ESD Suppressors
RoHS Pb _{PGB1 Series Lead-Free 0805 ESD Suppressor}
Product Overview
PulseGuard ESD Suppressors help protect sensitive electronic
equipment against electrostatic discharge (ESD). They supplement the
on-chip protection of integrated circuitry and are best suited for low-
voltage, high-speed applications where low capacitance is important.
Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394,
HDMI and DVI can benefit from this new technology. PulseGuard
suppressors use polymer composite materials to suppress fast-rising
ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E),
while adding virtually no capacitance to the circuit.
Features
• Lead-Free
• Ultra-low capacitance
• Low leakage current
• Fast response time
• 4-lines of protection
• Bi-directional
• Withstands multiple ESD strikes
• Based on industry standard 2012 package
• Compatible with pick-and-place processes
• Available in 1,000 and 5,000 piece reels (EIA-RS481)
Typical Applications
• HDTV Hardware
• Laptop/Desktop Computers
• Network Hardware
• Computer Peripherals
• Digital Cameras
• External Storage
• Set-Top Boxes
Ordering Information
CATALOG NUMBER
PIECES PER REEL
PGB1040805MR
1,000
PGB1040805NR
5,000
Design Consideration
Because of the fast rise-time of the ESD transient, placement of
PulseGuard suppressors is a key design consideration. To achieve
optimal ESD suppression, the devices should be placed on the circuit
board as close to the source of the ESD transient as possible. Install
PulseGuard suppressors directly behind the connector so that they are
the first board-level circuit component encountered by the ESD transient.
They are connected from signal/data line to ground.
Reference Dimensions:
Reflow Solder
0.71 (.028")
0.74
(.029")
1.27
(.050")
1.27
(.050") TYP
0.635 (.025")
0.74
(.029")
0.51 (.020")
0.279
(.011")
NOTE: When wave soldering, the gap between pads should be
covered with photo-imageable solder mask to prevent bridging
between terminations under the component. Also the spacing
between the ground contacts should be increased from
.635mm (.025") to .889 (.035").
2.03 (.080") TYP
0.203
(.008") TYP
0.127
(.005") TYP
Sn
0.406 (.016") TYP
Equivalent Circuit
1
6
2
5
3
4
206
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