MBRF30150CT Datasheet, PDF (1/3 Pages) Sangdest Microelectronic (Nanjing) Co., Ltd – SCHOTTKY RECTIFIER

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Cathode
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Schottky Barrier Rectifier
MBRF30150CT, 2x 15A, 150V, ITO-220AB, Common Cathode
MBRF30150CT
RoHS Pb
He^Paⁱtⁿsi^on^uk^t
Common
Cathode
1
Anode
Com² mon
Cathode
3
Anode
Pinout 2
TO-220AB
Common Cathode
Maximum Ratings
1
2
3
Anode ^Common Anode
Cathode
Pinout 3
ITO-220AB
Common Cathode
Heat si^Pn^ak^rameters
Pea_Ck_atI_hn_ov_de_erse Voltage
Average Forward Current
Peak Repetitive Forward Current(per leg)
Cathode
Anode
Pea₁k One CCyucrlreenNt₂o(np-eRrelpeegt)itive Surge
Pinout 5
TO-220AC
Electrical Characteristics
Symbol
V_RWM
I_F(AV)
I_FRM
I_FSM
Description
Littelfuse MBR series Schottky Barrier Rectifier is
designed to meet the general requirements of commercial
applications by providing high temperature, low leakage
and low V_F products.
It is suitable for high frequency switching mode power
supply, free-wheeling diodes and polarity protection
diodes.
Features
• High junction
temperature capability
• Guard ring for enhanced
ruggedness and long
term reliability
• Low forward voltage drop
• H igh frequency operation
• C ommon cathode
configuration in
electrically isolated ITO-
220AB package
Applications
• Switching mode power
supply
• Free-wheeling diodes
• DC/DC converters
• Polarity protection diodes
Test Conditions
-
50% duty cycle @T_C = 133°C,
rectangular wave form
Rated V_R square wave, 20KHz T_C = 133°C
Surge applied at rated load conditions
halfwave, single phase,60Hz
Max
150
15 (per leg)
30 (total device)
20
150
Unit
V
A
A
A
Parameters
Forward Voltage Drop (per leg) *
Reverse Current (per leg) *
Junction Capacitance (per leg)
Series Inductance (per leg)
Voltage Rate of Change
RSM Isolation Voltage
(t = 1.0 second, R. H. < =30%,
T_A = 25 °C)
* Pulse Width < 300μs, Duty Cycle <2%
Symbol
V_F1
V_F2
I_R1
I_R2
C_T
L_S
dv/dt
V_ISO
Test Conditions
@ 15A, Pulse, T_J = 25 °C
@ 15A, Pulse, T_J = 125 °C
@V_R = rated V_R T_J = 25 °C
@V_R = rated V_R T_J = 125 °C
@V_R = 5V, T_C = 25 °C f_SIG = 1MHz
Measured lead to lead 5 mm from package body
Clip mounting, the epoxy body away from the
heatsink edge by more than 0.110” along the
lead direction.
Clip mounting, the epoxy body is inside the
heatsink.
Screw mounting, the epoxy body is inside the
heatsink.
Max
1.00
0.80
1.0
6.0
400
8.0
10,000
4500
3500
1500
Unit
V
mA
pF
nH
V/μs
V
©2015 Littelfuse, Inc
Specifications are subject to change without notice.
Revised:11/09/15