LTPL-P05DZS27 Datasheet, PDF (21/27 Pages) Lite-On Technology Corporation – LED HIGH POWER

LED HIGH POWER
P05 Product Series
Notes:
1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended hand soldering
condition is 350°C max. and 2secs max. for one time only, and the recommended reflow soldering condition is 260°C
max. and 5secs max. for three times max.
2. All temperatures refer to topside of the package, measured on the package body surface.
3. The soldering condition referring to J-STD-020B. The storage ambient for the LEDs should not exceed 30°C
temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are soldered within
one week. For extended storage out of their original packaging, it is recommended that the LEDs were stored in a
sealed container with appropriate desiccant, or desiccators with nitrogen ambient. If the LEDs were unpacked more
than 168hrs, baking the LEDs at 60℃ for 60 minutes before soldering process.
4. The soldering profile could be further referred to different soldering grease material characteristic. The grease
vendor will provide this information.
5. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.
6. Although the recommended reflow conditions are specified above, the reflow or hand soldering condition at the
lowest possible temperature is desirable for the LEDs.
7. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip soldering
method.
021
BNC-OD-C131/A4
Created Date : 03/13/2013
Revison : 1.0, 03/13/2013