HSDL-3208-S21 Datasheet, PDF (13/22 Pages) Lite-On Technology Corporation – Ultra Small Profile Package IrDA® Data Compliant Low Power 115.2 kbit/s Infrared Transceiver

1.2 Recommended Metal
Solder Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder paste
printing. This is to ensure
adequate printed solder paste
volume and no shorting. See the
table below the drawing for
combinations of metal stencil
aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad
is 2.7 mm x 1.25 mm as per land
pattern.
APERTURES AS PER
LAND DIMENSIONS
l
Figure 18. Solder stencil aperture.
Stencil thickness, t (mm)
0.152 mm
0.127 mm
t
w
Aperture size(mm)
length, l
width, w
2.60 ± 0.05
0.55 ± 0.05
3.00 ± 0.05
0.55 ± 0.05
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no other
SMD components within this
area.
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm. It is recommended that
two fiducial crosses be placed at
mid-length of the pads for unit
alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
7.2
0.2
SOLDER MASK
2.6
3.0
UNITS: mm
Figure 19. Adjacent land keepout and solder mask areas.
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