CN-111010 Datasheet, PDF (1/2 Pages) Lite-On Technology Corporation – Tin Lead Plating Phase Out for Leadframe Products

November 10, 2010
CN-111010
Customer Notification
Tin Lead Plating Phase Out for Leadframe Products
Dear Valued Customer:
This notification is for the purpose of informing you that our supplier, Amkor Korea, will phase out all Tin Lead
plating by the end of 2010 for leadframe based products listed below. All parts affected by this notification will now
be assembled using Matte Tin plating.
Purpose
The purpose of the change at our supplier is to standardize their process to the Pb-free industry trend and in
alignment with decreasing Tin Lead customer demand. This standardization will bring them in line with green
environment (Pb-free) initiatives, eliminate a low efficiency process and provide better, more stable quality and
service.
Product Affected
M21012-12
CX28331-18
M28332-34
M28945-33
M28331-34
CX28333-18
M28927-29
CX28332-18
M28333-34
Change Schedule
The affected products will begin to ship in January 2011.
Method to identify parts
The part date code will start with 11xx.
Customer Impact
No customer impact is anticipated with this notification; Amkor has performed backward compatibility testing to
assure that parts assembled with Matte Tin finish will pass solderability tests using the Tin Lead eutectic solder
reflow profile.
We are confident this notification will allow Mindspeed Technologies to maintain its high standards for quality and
reliability. If, at any time, you have a need for further information, please contact your local Sales Representative.
Lack of acknowledgement of this notification within 30 days constitutes acceptance of the change. After
acknowledgement, lack of additional response within the 45 day review period constitutes acceptance of the change.
Rev. 12/98
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